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Tuesday, Sep 15, 2026

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Intel to Fab HBM Base Dies for Hynix and Micron by 2029
topics 💻 Tech💼 Business🤖 AI tags AIAI InfraAI Chips keywords IntelHynixMicronSK HynixLakeWafer ForestNvidia

Production capacity for the 18A process will reach 80 KPM by the end of 2028, supporting a $150 target price based on a sum-of-the-parts valuation. Intel is expanding its foundry client base to include High Bandwidth Memory base die fabrication for SK Hynix and Micron starting in 2029, while 18A yields for Panther Lake hit 80% in the second quarter of 2026. Server CPU yields for Clear Wafer Forest rose to 50% from 20% in June.

Backend pipeline revenues are projected at $1.1 billion in 2027 and $7 billion in 2028, with 14A capacity reaching 24 KPM by the end of that period. Japanese suppliers for EMIB substrates reached 45% yields and target 55% in January. Other developments include potential PC cooperation with Nvidia and the adoption of Intel x86 CPUs for head-nodes in a Rosa Feynman variant.

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Intel Target Price Hits $150 on Nvidia x86 CPU Win
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